Maestro A2200-A Bedienungsanleitung PDF herunterladen (Seite 23)

V1.0 – Feb-12

User’s Manual

Page 23 of 35

7 Mounting

This chapter describes the suggested mounting process for the A2200-A receiver

module. In a RoHS compliant product with a RoHS compliant process it is recom-

mended to use chemical tin as the counter-part to the module’s pins. This will

guarantee highest resistance against shocks.

7.1 Proposed Footprint for Soldering

Following soldering footprint parameters are recommended:

 Copper and solder paste footprint are identical

 Pad-shape / -size, inner pads: 1.2 mm x 1.2 mm

 Pad-shape / -size, outer pads: 1.0 mm x 0.8 mm

 Stencil thickness of 120 – 150 µm

7.2 Recommended Profile for Reflow Soldering

Typical values for reflow soldering of the module in convection or IR/convection

ovens are as follows (according to IPC/JEDEC J-STD-020D):

Parameter

Value

Peak temperature (RoHS compliant process)

245°C

Average ramp up rate to peak (217°C to Peak)

3°C / second max.

Preheat temperature

min=150°C; max=200°C

Ramp up time from min. to max. preheat temperature

60 … 120 seconds

Temperature maintained above 217°C

60 … 150 seconds

Time within 5°C of actual peak temperature

30 seconds

Ramp down rate

6°C / second max.

Time 25°C to peak temperature

8 minutes max.

Table 8: Reflow soldering profile A2200-A

The solder pads hold solder of a thickness of about 150 µm for improved solder

process results.

As results of soldering may vary among different soldering systems and types of

solder and depend on additional factors like density and types of components on

board, the values above should be considered as a starting point for further optimi-

zation.

1 2 ... 18 19 20 21 22 23 24 25 26 27 28 ... 34 35

Keine Kommentare

Maestro A2200-A Bedienungsanleitung Seite 23