Maestro A2200-A Bedienungsanleitung PDF herunterladen (Seite 25)

V1.0 – Aug-13

User’s Manual

Page 25 of 37

7 Mounting

This chapter describes the suggested mounting process for the A2235-H GPS re-

ceiver modules. In a RoHS compliant product with a RoHS compliant process it is

recommended to use chemical tin as the counter-part to the module’s pins. This will

guarantee highest resistance against shocks.

7.1 Proposed Footprint for Soldering

The following proposal of a footprint for soldering is assuming a stencil thickness of

150µm.  marks the center of the through holes.

Figure 11: Proposal of Soldering footprint

Please note that copper and solder paste footprints are identical. The final footprint

has to be evaluated and qualified by the manufacturer according to the specific

process.

7.2 PCB Design Guide

1. Drill a through hole with diameter greater than or equal to 3mm in the application

PCB which is underneath the RF feed-point to alleviate the interference from RF

signal to other part of circuitries. Besides, ground vias (says, 8) should be placed

surrounding the through hole for further shielding purpose.

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