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V1.3 – Jul-12 User’s Manual Page 23 of 32

7 Mounting

This chapter describes the suggested mounting process for the A2035-H receiver

modules. In a RoHS compliant product with a RoHS compliant process it is rec-

ommended to use chemical tin as the counter-part to the module’s pins. This will

guarantee highest resistance against shocks.

7.1 Proposed Footprint for Soldering

The following proposal of a footprint for soldering is assuming a stencil thickness of

150µm. ³ marks the center of the through holes.

Figure 11: Soldering footprint proposal A2035-H

Please note that copper and solder paste footprint are identical. The final footprint

has to be evaluated and qualified by the manufacturer according to the specific

processes.

7.2 Recommended Profile for Reflow Soldering

Typical values for reflow soldering of the module in convection or IR/convection

ovens are as follows (according to IPC/JEDEC J-STD-020D):

Parameter Value

Peak temperature (RoHS compliant process) 245°C

Average ramp up rate to peak (217°C to Peak) 3°C / second max.

Preheat temperature min=150°C; max=200°C

Ramp up time from min. to max. preheat temperature 60 … 120 seconds

Temperature maintained above 217°C 60 … 150 seconds

Time within 5°C of actual peak temperature 30 seconds

Ramp down rate 6°C / second max.

Time 25°C to peak temperature 8 minutes max.

Table 9: Reflow soldering profile A2035-H

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