Maestro A2100-A Bedienungsanleitung PDF herunterladen (Seite 25)

V1.2 – May-11 User’s Manual Page 25 of 37

7 Mounting

This chapter describes the suggested mounting process for the A2100-A receiver

modules. In a RoHS compliant product with a RoHS compliant process it is

recommended to use chemical tin as the counter-part to the module’s pins. This will

guarantee highest resistance against shocks.

7.1 Proposed Footprint for Soldering

Following soldering footprint parameters are recommended:

• Copper and solder paste footprint are identical

• Pad-shape / -size, inner pads: 1.5 mm x 1.5 mm

• Pad-shape / -size, outer pads: 1.0 mm x 0.8 mm

• Stencil thickness of 120 – 150 µm

7.2 Recommended Profile for Reflow Soldering

Typical values for reflow soldering of the module in convection or IR/convection

ovens are as follows (according to IPC/JEDEC J-STD-020D):

Parameter Value

Peak temperature (RoHS compliant process) 245°C

Average ramp up rate to peak (217°C to Peak) 3°C / second max.

Preheat temperature min=150°C; max=200°C

Ramp up time from min. to max. preheat temperature 60 … 120 seconds

Temperature maintained above 217°C 60 … 150 seconds

Time within 5°C of actual peak temperature 30 seconds

Ramp down rate 6°C / second max.

Time 25°C to peak temperature 8 minutes max.

Table 11: Reflow soldering profile A2100-A/B

The solder pads hold solder of a thickness of about 150 µm for improved solder

process results.

As results of soldering may vary among different soldering systems and types of

solder and depend on additional factors like density and types of components on

board, the values above should be considered as a starting point for further

optimization.

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Maestro A2100-A Bedienungsanleitung Seite 25